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Scanning electron microscope(sem) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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Scanning electron microscope Product List

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[Slice&View] Three-Dimensional SEM Observation Method

[Slice&View] Three-Dimensional SEM Observation Method

By repeatedly performing cross-sectioning processing with FIB and observation with SEM, and reconstructing the obtained images, three-dimensional structural information can be obtained.

Using a high-resolution SEM device equipped with FIB, we can obtain three-dimensional structural information by repeatedly performing cross-sectioning (Slice) with FIB and observing (View) with SEM, and then reconstructing the acquired images. Similarly, Slice & View is also possible for SIM (Scanning Ion Microscope) images. - It is possible to observe secondary electron (SE), backscattered electron (BSE) images, and scanning ion microscope (SIM) images.

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  • Contract Analysis
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  • Contract Inspection

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Differences in appearance due to SEM observation conditions

Differences in appearance due to SEM observation conditions

Introducing SEM images taken under various conditions! An explanation of the differences in appearance based on SEM observation conditions.

SEM observation involves detecting secondary electrons and backscattered electrons generated when electrons irradiate the surface of the sample and scatter in the outermost layer of the sample. These are captured by a detector and displayed as an image on a monitor. There are various types of detectors for capturing electrons, each producing images that leverage their unique characteristics, and the appearance can change by varying the acceleration voltage. In this document, we introduce SEM images captured under various conditions. We encourage you to read it. [Contents] ■ Backscattered Electron Images - Backscattered electron images at high acceleration voltage (AsB detector) - Backscattered electron images at low acceleration voltage (EsB detector) ■ Secondary Electron Images - Differences in appearance based on acceleration voltage - Differences in appearance based on detector position *For more details, please refer to the PDF document or feel free to contact us.

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  • Other contract services

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[Analysis Case] Composition Analysis of Particles on a Wafer

[Analysis Case] Composition Analysis of Particles on a Wafer

Shape observation and simple quantitative analysis using SEM-EDX.

Control of particles in the semiconductor wafer manufacturing process is extremely important for ensuring wafer quality. In this case study, we estimated what the particles were on a Si wafer through SEM observation, EDX analysis, and simple quantification. The SEM equipment, which has high spatial resolution in the submicron range and can scan areas of several centimeters, allows for rapid inference of what the particles on the wafer are based on shape and composition information, enabling quick identification of the generation process. Analysis linked to coordinate data from defect inspection equipment is also possible.

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  • Contract Inspection
  • Wafer
  • Other semiconductor manufacturing equipment

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Technical Data: Low Vacuum SEM (Observation and Evaluation of Adhesive Interfaces)

Technical Data: Low Vacuum SEM (Observation and Evaluation of Adhesive Interfaces)

Introduction to observation and evaluation analysis of low vacuum SEM that does not require coating processes such as vacuum deposition!

Our company is engaged in the analysis solutions business. In low vacuum SEM, coating treatments (pre-treatments) such as vacuum deposition are not required for sample preparation. Even for samples such as insulators, semiconductors, and food, after low vacuum SEM observation without coating treatment, they can be used directly for other analyses. [Contents] ■ Overview ■ Analysis Examples ・ Observation and evaluation of adhesive interfaces *For more details, please refer to the PDF document or feel free to contact us.

  • Analytical Equipment and Devices
  • Other services

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FE-SEM observation (Crystal grain observation of Al wire bonding section)

FE-SEM observation (Crystal grain observation of Al wire bonding section)

High-brightness electron gun for detailed SEM images! Equipped with an in-lens SE detector sensitive to surface information.

The ZEISS "FE-SEM ULTRA55" is equipped with a GEMINI column, allowing for high-resolution observation at extremely low acceleration voltages. It also features multiple detectors, enabling the observation of various samples. Composition information can be obtained using two types of backscattered electron detectors, and high-resolution EDX analysis can be performed even at low acceleration voltages. 【Features】 ■ High-brightness electron gun for detailed SEM images ■ Ultra-surface analysis at extremely low acceleration voltages ■ In-lens SE detector sensitive to surface information ■ Composition information obtained from two types of backscattered electron detectors ■ High-resolution EDX analysis even at low acceleration voltages ■ Observation without deposition *For more details, please refer to the PDF document or feel free to contact us.

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  • Analytical Equipment and Devices
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[Analysis Case] Observation of Fine Structures under Ultra-Low Acceleration Voltage Conditions using SEM

[Analysis Case] Observation of Fine Structures under Ultra-Low Acceleration Voltage Conditions using SEM

Evaluation of separator structure by ultra-low acceleration SEM observation.

As exemplified by the separators used in lithium-ion secondary batteries, the microstructure of materials, such as porosity and shape, significantly influences the characteristics and functions of products. When materials have a low softening point, such as resins or polypropylene (PP), they may be damaged by electron beam irradiation during observation, leading to changes in their original structure. We will present a case where ultra-low acceleration SEM observation at an acceleration voltage of 0.1 kV was used to suppress alteration and evaluate the surface morphology of the sample in detail.

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Scanning Electron Microscope (SEM) Observation

Scanning Electron Microscope (SEM) Observation

Observation of non-conductive samples without deposition is possible! Scanning electron microscopy is ideal for surface observation of fibers and similar materials.

A "Scanning Electron Microscope (SEM)" is a device that irradiates and scans a finely focused electron beam on a sample, detects secondary and backscattered electrons, and displays their intensity as an image on a monitor to obtain magnified images of the object. Although it is not suitable for high magnification observation due to reduced image quality, it can use low vacuum mode, allowing for non-coating observation of difficult-to-conduct samples. [Observation Items] ■ Surface observation at magnifications of 5 to 300,000 times ■ Elemental analysis (B to U) using an energy-dispersive X-ray spectrometer (EDS) as an accessory ■ Element identification in micro-regions (qualitative and semi-quantitative analysis) *For more details, please refer to the catalog or feel free to contact us.

  • Analytical Equipment and Devices

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FE-SEM (with EDS/EBSD observation)

FE-SEM (with EDS/EBSD observation)

A finely focused electron beam is irradiated onto the sample! An electron microscope that can also analyze crystal orientation and crystal structure!

The "FE-SEM (Field Emission Scanning Electron Microscope)" is a device that irradiates and scans a finely focused electron beam onto a sample, allowing for clearer magnified images compared to general-purpose SEMs. Additionally, by utilizing a finely focused strong electron beam and employing the Electron Back-Scatter Diffraction (EBSD) method, it is possible to analyze crystal orientation and crystal structure. 【Applicable Targets】 ■ General metal materials ■ Ceramics ■ Fibers (requires deposition treatment) *For more details, please refer to the catalog or feel free to contact us.

  • Analytical Equipment and Devices
  • Electron microscope

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Collection of Case Studies on Cross-Section Observation and Structural Analysis (e.g., FE-SEM/EBSD) 2

Collection of Case Studies on Cross-Section Observation and Structural Analysis (e.g., FE-SEM/EBSD) 2

We will introduce various cases of micro-section machining and analysis, residual stress measurement, and more using ion milling, FE-SEM, EBSD, etc. The materials are available for download.

In this case study collection, we will introduce examples related to "cross-sectional observation and structural analysis." Starting with the analysis case of "Evaluation of aluminum sputter films using EBSD," we also include numerous examples such as the purpose, methods, samples, and results of "Cross-sectional processing of micro areas by ion milling," and the purpose, methods, and results of "Residual stress measurement of solder cross-sections." Additionally, we present orientation evaluations, cross-sectional observation results, and measurements. We encourage you to read through it. 【Contents】 ■ Evaluation of aluminum sputter films using EBSD ■ Cross-sectional processing of micro areas by ion milling ■ Residual stress measurement of solder cross-sections ■ Residual stress measurement of wire ■ Cooling (cryo) ion milling cross-sectional processing *For more details, please refer to the PDF document or feel free to contact us.

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  • Other polymer materials
  • Other metal materials

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CD-SEM

CD-SEM

CDSEM, boasting an overwhelming market share, along with the Hitachi S8000 and S9000 series. We have a constant inventory of equipment and a complete demonstration system in place.

【Equipment Modification】 ■ Sale of refurbished used equipment ■ Modification for small diameter and compound wafers ■ SMIF to open cassette modification ■ Modification for multiple wafer types (using tray) 【Regular Maintenance】 ■ Chip replacement 【Relocation Services】 ■ In-house relocation ■ Factory relocation 【Troubleshooting】

  • Semiconductor inspection/test equipment

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Observation of the cutting edge surface of single crystal diamond chips.

Observation of the cutting edge surface of single crystal diamond chips.

Scanning Electron Microscope (SEM) ■Industry: Automotive (Prototype) / Semiconductor / Robotics

The cutting edge surface of single crystal diamond chips was observed using a scanning electron microscope (SEM). The cutting edge surface of PCD (polycrystalline diamond) was also observed and compared. The differences in the fine surface roughness were clearly confirmed. How this difference affects the machining process is yet to be determined. *For more details, please refer to the PDF document or feel free to contact us.*

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[Analysis Case] Extraction of Active Material from Battery Cathode Material and Data Analysis

[Analysis Case] Extraction of Active Material from Battery Cathode Material and Data Analysis

We determined the particle size of active substances from SEM images using deep learning and data analysis.

Deep learning enables the extraction of target objects from images. Additionally, by analyzing the regions corresponding to the obtained targets, information can be obtained in numerical form. In this instance, we used deep learning to extract active material particles and detect cracks in cross-sectional SEM images of battery cathode materials. Extraction is also possible for 3D data, such as Slice&View data. We extracted particles with and without cracks from the 3D data and calculated their respective particle sizes. Measurement methods: SEM, Slice&View, computational science, AI, data analysis Product fields: Solar cells, secondary batteries, fuel cells Analysis purposes: Structural evaluation, shape evaluation, failure analysis, defect analysis For more details, please download the materials or contact us.

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JIB-PS500i FIB-SEM system

JIB-PS500i FIB-SEM system

Cutting-edge technologies for sample preparation, observation, and analysis.

Japan Electron Co., Ltd. JIB-PS500i offers three solutions to assist in TEM sample preparation. You can work with a reliable and high-throughput workflow from sample preparation to TEM observation. 〇 Features - The dual-axis tilt cartridge and TEM holder facilitate the link between TEM and FIB. - The cartridge can be easily attached to a dedicated TEM sample holder with one touch. - Accurate and rapid pickup operations are possible. - Seamlessly transition from TEM sample preparation to STEM observation. - The automatic TEM sample preparation system STEMPLING2 automates TEM sample preparation. *For more details, please download the PDF or feel free to contact us.

  • Other physicochemical equipment

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[Analysis Case] Cell Cycle Assessment from Bacterial Images

[Analysis Case] Cell Cycle Assessment from Bacterial Images

By using deep learning and data analysis, we can evaluate sample characteristics by utilizing large amounts of data.

We observed a sample mixed with three types of lactic acid bacteria using SEM, and extracted the bacteria by type using deep learning from the obtained images. Furthermore, we conducted data analysis to determine the presence ratio on the cell cycle based on the shape of the lactic acid bacteria. Measurement methods: SEM, computational science, AI, data analysis Product fields: Biotechnology, pharmaceuticals, daily necessities, cosmetics, food Analysis purpose: Shape evaluation, product investigation For more details, please download the materials or contact us.

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